A well-funded, early stage company on the West Coast is looking for a Senior MEMS Package Development Engineer to spearhead the development of packaging and assembly for a MEMS system.  The desired engineer would work with a small team in an exciting and dynamic environment to move their MEMS technology toward a commercial product.

Responsibilities

·       Work to develop initial packaging and assembly for a MEMS based system

·       Do design work to develop prototype packages for the system

·       Work to select packaging and assembly partners and technology to meet product electrical and reliability specifications

·       Work with packaging partners to prototype package and improve performance while minimizing cost

·       Conduct failure analysis, material characterization, and accelerated tests to study package reliability

·       Perform package modeling in order to predict package performance and limitations

·       Develop assembly process to assemble and evaluate packaging

·       Troubleshoot product and modify package in order to meet product specifications

Required Skills

·       B.S., M.S. or Ph.D. Required

·       In-depth knowledge and experience with semiconductor packaging and assembly technology

·       Experience in packaging techniques and methods desirable

·       Experience predicting and evaluating package reliability desirable

·       Experience in mechanical design, material selection, and electrical characterization of semiconductor packaging required